Things are progressing with the UM3X. Active levelling was an issue, I think at least partially corrected going to the current firmware. But a new issue is emerged.
Printing a simple, flat design, 0.2 layer height, 0.4 mm AA core, Ultimaker PLA. Bed at 60C and imaged at that temp, so correct (but slow to heat). Active levelling appeared to complete.
The pictures tell the story. transparent in the middle, much too thick at the sides, as if overextruded. Eventually thi