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Giving the Heated Bed more oomph

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Hello Guys,

i have a big Problem with the Heated Bed on my UM2( converted to +).

I use a Permanent Build Plate which requires me to heat the Bed to specific Temperatures.

For PLA they say heat up to 65°C after the first layer lower to 60°C.

Null Problemo, Pla sticks fine to the Bed, after the print is finished i can simply nock it off the Bed. No warping, no getting loose of the print, without any adheison stuff like Glue or Hairspray.

For ABS they say, heat up to 110°C and after the first layer lower to 100°. There starts my Problem. I cant crank it up to 110. Firmware only allows me to go up to 100°. Problem is, the ABS does not stick to my Plattform at all at 100°.

I have a second printer (not an Ultimaker) which i used to verify this behavior.

On this machine i can print ABS with no problems, just heating the bed to 110° and after a layer cooling it down to 100.

ABS sticks like hell to the bed. After cooling down, i can just simply nock it off. Same Permanent Build Plate used.

Lowering the start Temperature of the Bed to 100° at the Start and voila, ABS does not Stick like on the UM2.

However the print quality and quantity is no match for my UM2+ and i have a big part which i tried to print in PLA for a vehicle and guess what, the sun killed it.

So, how can i either convince the heated Bed of the UM2 to go above 100°? Or has someone swapped out the heated bed for something with more oomph, which doesn't take that long to heat up to high temps?

I wouldn't mind using another PSU for the heated bed and i am not afraid to modify the electronics as my printer is now over two years old i don't have to think about warranty at all.

Thx in Advance for your responses.

Edited by Guest

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Giving some answers to myself. Seems like the Firmware Update to the + does currently limit to 100° Bed Temperature .......

After switching to TinkerGnome's Version of the Firmware i can select higher temps.

Still, the last question. Someone modified the original Bed? :)

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