Meltdown - some advice please - HELP

[sammo 0]

During a print overnight a couple of parts failed to stick to the bed and I've had the problem where excess material ( PLA/ PHA ) has blobbed around the print head.  ( UM2 converted to a UM2+ )

This does happen from time to time (probably about once a year) but this time it's quite a bad case.

The PLA has wrapped itself around the base of the wires going into the head, so I think the only way I'm going to be able to remove the head is to cut the wires.

Is it a lost cause?

Do I need to order a new head/temp sensor?

I'll contact the suppliers Dream3D today for some advice, but I thought I'd ask here too in case it's something someone here has experience of.

Thanks for your time

Bri

Edited December 17, 2016 by Guest

[peggyb 171]

don't cut anything (yet)!

do you have a heat gun - hairdryer - soldering iron?

You can use these to heat the excess pla from the outside. Heat the nozzle to 150 or so to get some play/movement on the inside of the blob. Be gentle around the wires, you can save them.. Slowly peel away as many as you can. Succes!

Edited December 17, 2016 by Guest

[sammo 0]

don't cut anything (yet)!

do you have a heat gun - hairdryer - soldering iron?

You can use these to heat the excess pla from the outside. Heat the nozzle to 150 or so to get some play/movement on the inside of the blob. Be gentle around the wires, you can save them.. Slowly peel away as many as you can. Succes!

 

Thanks Peggy

The last time this happened, I figured it would be a good time to just upgrade the UM2 to a plus anyway, but that was a £400 bill.

I'll give it a go with an old soldering iron