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Ultimaker Community of 3D Printing Experts


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  1. I tested it with my UM3 and it works, but there's an issue when doing the active leveling, as the nozzles would dig into the bed and melt the BuildTak. But I found a solution: Flip the build plate around when doing the active leveling. Then, after it's done, flip it again. The thickness is the same either way, so it works great.
  2. I use BuildTak on my UM2+ and love it. Is it possible to use BuildTak on the UM3? I wonder if it would interfere with the new capacitive leveling function. It would seem like adding an extra couple of mm wouldn't make a difference with a capacitive sensor, but I wonder if Ultimaker can answer this officially.
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