I print with HT on 265C, but I have used 260C and it wasn't more brittle – but had to print at a slightly slower speed.
To make really tough parts I increase the flow, it really benefits the HT. However increased flow will also sometimes give excess material, so be careful with the adjustments especially if your objects should look good. Also like XT and nGen, material sticking to the nozzle becomes brown and makes ugly spots on light colors. For even tougher parts increasing to 100% infill makes them almost indestructable, and thicker perimeters are also helping.
Even if you print only at 260C I think having the extra i2k beneath the teflon is a must, just remember that for the 2+ models you would need either a spring or a custom part as the part above the teflon is only one size and will not fit with the stock teflon and i2k at the same time.
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neotko 1,417
You might want to look into I2K (3dsolex) and tinkergnome firmware. Google time!
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