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Please give us more flexibility.

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Posted · Please give us more flexibility.

Hello,

 

as much as i enjoy working with your quite robust machine - two mysterious nozzle clogs aside -, as i am sure you are aware there are always issues that require manual fiddling with FDM printers.

 

Especially with the SSH bug i am experiencing making it impossible to direct control via G-Code, the quite ridig workflow with the machine's menu is testing my patience more often than not.

 

Please please please allow us to:

- First and foremost: Make the "Skip cooldown" option actually skip the bed cooldown cycle! If I have removed a failed print from a 110°C bed I would like to start over without waiting for a full cycle. (i started using a 12V fan because it takes ages otherwise....!)

- Allow manual extrusion at a set temperature. When "Move" ing material, the temperature is reset to an arbitrary value. This is a requirement to clear nozzles when changing materials! Currently, i am heating the extruder up then quickly switching to "Move" while it cools down. This is unsatisfactory.

 

These two things would be a major improvement. There is plenty more room for increased flexibility, e.g. manual extrude at a specified rate, etc.

 

Also, during levelling the printer shows some questionable behaviour, which already destroyed one my buildtaks: It heats the bed and the extruders to the print configuration value, then starts levelling while the extruders (and bed?) cool down. This made a few holes in the surface of the buildtak, and it somewhat questionable. Heat the bed to adjust for thermal expansion, but not higher than, e.g. 80 °C and either leave the extruders cold or heat them up to no more than 200°C. When the machine destroyed the buildtak, it was configured for Tribofilament at 280°C/120°C.

 

Also please make an attempt to reduce apparently useless waiting sequences during print preparation.

 

Disregarding all of these additional things, if you could make everyday workflow less painful with the two main suggestions given above, that would be highly regarded.

 

 

 

 

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Posted · Please give us more flexibility.

Hi @sono, thank you for your feedback. It's very helpful to hear back directly from our users. @territerriterri, for your information. Please feel free to take this any further if necessary with follow-up questions. 

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Posted · Please give us more flexibility.
5 hours ago, sono said:

- First and foremost: Make the "Skip cooldown" option actually skip the bed cooldown cycle! If I have removed a failed print from a 110°C bed I would like to start over without waiting for a full cycle. (i started using a 12V fan because it takes ages otherwise....!)

we were actually talking about removing this recently, it skips waiting for the deprime(and purge if you have a material station) which is the intended behavior, and is meant to get you ready for the next print ASAP. it would work quit well in the 5.5.x version but is broken in 5.4.x we are aware but people keep telling me nobody uses it.... so the option to remove it is a serious possibility.

I use it quite a bit so I'll use this to argue to keep it, if you don't mind.  We may need to rename it though...

 

5 hours ago, sono said:

Also, during levelling the printer shows some questionable behaviour, which already destroyed one my buildtaks: It heats the bed and the extruders to the print configuration value, then starts levelling while the extruders (and bed?) cool down. This made a few holes in the surface of the buildtak, and it somewhat questionable. Heat the bed to adjust for thermal expansion, but not higher than, e.g. 80 °C and either leave the extruders cold or heat them up to no more than 200°C. When the machine destroyed the buildtak, it was configured for Tribofilament at 280°C/120°C.

Look, the machine wasn't build with buildtak in mind, sorry, sad to hear it's a problem.

The" build temperature initial layer" setting in cura might help but for the rest, it is just not designed for that and buildtak may cause the bed leveling to be off as well., the leveling method requires a lot of assumptions about the surface of the buildplate, change those and it is unlikely to work as well as you might otherwise expect.

 

I use dissolved old PVA for adhesion, 3d lack/hairspray also works great or use a glue-stick, but add anything 3rd party to the mix and you are likely outside of designed for specs... 

 

5 hours ago, sono said:

Also please make an attempt to reduce apparently useless waiting sequences during print preparation.

Higher reliability vs ease of use is a very difficult decision to make,  what appears unnecessary may actually serve a purpose, which  just isn't obvious (like resetting the nozzle lift switch) or why the heaters appear off during leveling (interference with the sensor) etc. but we do have some stories planned for this, if you could be more specific that might help. but then I'd suggest a video where you indicate the slow/useless bits and precise version numbers and any preconditions like you did a print before that you aborted, etc.

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Posted · Please give us more flexibility.

Glad to hear you take this so seriously, I am sure i will post more a detailed follow-up come the new year.

 

As noted it's mostly about the forced bed cooldown cycle where the fw forces one to wait for the bed to go below 60°C before it starts the next print cycle (for safety reasons?) which i have taken physical measures to speed up, using the fan from a nearby soldering station, which is a little ludicrous. It would be good if there was a user friendly manual override or a configurable cooldown end temperature.

When I have safely and cleanly removed a print I would want to start the next cycle, having to wait instead for the machine to cool down further is quite annoying as it can take several minutes for the bed to cool down even with fanning. Consider that all of this is done with the knowledge that the next thing the machine will do is heat the bed back up. Annoying!

 

Second, the awkward manual nozzle purging procedure after a filament change from a higher to a lower temperature filament could be made easier if the "Move" command did not reset the manually set head temperature. The head temperature could still revert to idle after an inactivity timeout or similiar, as long as the nozzle stays at the manually set temperature during filament operation. We do not have a material station so i can't speak for that.

 

I don't mind the destroyed buildtak, it was lessons learned. You may be glad to hear that the levelling worked perfectly with the third party surfaces (still using a PEI buildtak for PLA which is not taking noticeable damage at those temps), until the 270°C hot nozzle dug into the 120°C surface which I only tried based on user reviews of the buildtak. Now I know. Which is fine!

 

I am questioning the sanity of heating up the nozzles before levelling and then letting them cool down during the levelling process just to heat them back up. It seems to me that thermal expansion of such a small volume of metal can't be the driving factor to have them heat up in the first place. I realize (now) that you don't support the use of aftermarket surfaces, and there are a lot of factors that i was and am still unaware of (e.g. the mentioned EMF with the capacitve sensor etc.) and by no means do i wish to sound overly critical.

 

It just *appeared* to me that there was not much focus on speedy print cycle turnover and flexibility vs. achieving a robust and steady workflow so i wanted to make that voice heard.

 

Either way happy holidays and a great new year to all of you, great product , don't work too hard until january 🙂

 

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Posted · Please give us more flexibility.
On 12/20/2019 at 11:38 AM, sono said:

Glad to hear you take this so seriously, I am sure i will post more a detailed follow-up come the new year.

 

As noted it's mostly about the forced bed cooldown cycle where the fw forces one to wait for the bed to go below 60°C before it starts the next print cycle (for safety reasons?) which i have taken physical measures to speed up, using the fan from a nearby soldering station, which is a little ludicrous. It would be good if there was a user friendly manual override or a configurable cooldown end temperature.

When I have safely and cleanly removed a print I would want to start the next cycle, having to wait instead for the machine to cool down further is quite annoying as it can take several minutes for the bed to cool down even with fanning. Consider that all of this is done with the knowledge that the next thing the machine will do is heat the bed back up. Annoying!

 

Second, the awkward manual nozzle purging procedure after a filament change from a higher to a lower temperature filament could be made easier if the "Move" command did not reset the manually set head temperature. The head temperature could still revert to idle after an inactivity timeout or similiar, as long as the nozzle stays at the manually set temperature during filament operation. We do not have a material station so i can't speak for that.

 

I don't mind the destroyed buildtak, it was lessons learned. You may be glad to hear that the levelling worked perfectly with the third party surfaces (still using a PEI buildtak for PLA which is not taking noticeable damage at those temps), until the 270°C hot nozzle dug into the 120°C surface which I only tried based on user reviews of the buildtak. Now I know. Which is fine!

 

I am questioning the sanity of heating up the nozzles before levelling and then letting them cool down during the levelling process just to heat them back up. It seems to me that thermal expansion of such a small volume of metal can't be the driving factor to have them heat up in the first place. I realize (now) that you don't support the use of aftermarket surfaces, and there are a lot of factors that i was and am still unaware of (e.g. the mentioned EMF with the capacitve sensor etc.) and by no means do i wish to sound overly critical.

 

It just *appeared* to me that there was not much focus on speedy print cycle turnover and flexibility vs. achieving a robust and steady workflow so i wanted to make that voice heard.

 

Either way happy holidays and a great new year to all of you, great product , don't work too hard until january 🙂

 

I have the same complaints since the last update I performed, seems like a waste of time since we print a lot of CPE and PC and it takes a while to heat up the build plate. Regarding the Buildtak, we use the Ultimaker Adhesion Stickers and the same thing happens with those; the nozzle melts holes in them and like you said it seems unnecessary to preheat everything so hot. @SandervG I think it would be simple to change the logic to use the buildplate/nozzle temps from the upcoming print but max out at 70 or 80C on the bed and 230C on the nozzles.

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Posted · Please give us more flexibility.

happy holidays, After the vacation I'll be sure to discuss this between the 3 printer firmware teams. Though I don't think it will be all that easy, putting a max on the probing temperature is not difficult but between all the different materials and wanting to be able to push trough blobs left on the nozzle from the current or a previous material without destroying any adhesion aids might be tricky.

I do agree that it's a shame we can't keep the hotends heated during all of the probing. Though if the cool-down of the metal from the hotend influences the leveling position significantly we could also compensate by calculating the lost expansion due to the temperature difference.

 

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Posted · Please give us more flexibility.

Just had the first test run with a buildtak print surface
I had the exact same problem, so I searched for a solution here in the forum. 


The nozzle making holes into the buildtak additional surface is not really ideal. what I would love to see is an option within the menu (using an ultimaker s3) to choose between different print-surfaces.  this way you could choose maybe a glass (standard), buildtak, others... after that the printer knows on which surface he prints on, so that the starting routine could be the right one depending on the surface material. 

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Posted · Please give us more flexibility.
On 12/19/2019 at 3:49 PM, sono said:

 

Please please please allow us to:

- First and foremost: Make the "Skip cooldown" option actually skip the bed cooldown cycle! If I have removed a failed print from a 110°C bed I would like to start over without waiting for a full cycle. (i started using a 12V fan because it takes ages otherwise....!)

 

👍 Exactly what I need too

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Posted · Please give us more flexibility.

@robinmdh i know this has been mentioned before but please can we have a someway to see more information on the display, like layer number, be able to adjust retraction on the fly etc, i understand you don't want this available by default but an 'engineering mode' so people who want to see it can would be really really good !. Having this basic print info missing on the display is really lacking compared to even a £200 Chinese printer. It just makes debugging print issues so much harder !

 

Also, is there a way to stop a a disabled print core heating up during the bed level process, i have my second core disabled (but still in the print head) for single extrusion prints, but during the bed level process this core still has to heat up to over 200deg just to do a single probe at the start of the sequence, why does this need to happen and also if that core is disabled in cura when does it prob at all ?, i would rather that core wasn't heat cycles for no reason, that will def add to its potential lifespan.

 

many thanks

 

 

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Posted · Please give us more flexibility.
2 hours ago, Link said:

@robinmdh i know this has been mentioned before but please can we have a someway to see more information on the display, like layer number, be able to adjust retraction on the fly etc, i understand you don't want this available by default but an 'engineering mode' so people who want to see it can would be really really good !. Having this basic print info missing on the display is really lacking compared to even a £200 Chinese printer. It just makes debugging print issues so much harder !

 

Also, is there a way to stop a a disabled print core heating up during the bed level process, i have my second core disabled (but still in the print head) for single extrusion prints, but during the bed level process this core still has to heat up to over 200deg just to do a single probe at the start of the sequence, why does this need to happen and also if that core is disabled in cura when does it prob at all ?, i would rather that core wasn't heat cycles for no reason, that will def add to its potential lifespan.

 

many thanks

 

 

 

first:

I agree

 

second:

I also asked this and its to melt Material that maybe stick on the noozle and would "crash" into the bed while the auto bed niveling.

 

 

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