yes. Well here is what I think is a more precise explanation for leveling on both UM2 and UM3.
The calibration card has a thickness. Say it's 0.15mm (not 100% sure). when you level with this the firmware is assuming the nozzle is this distance from the glass (0.15mm or whatever the thickness is). At this point the printer realizes that the nozzle and the glass are 0.15mm apart so it stores this calibration information such that forever in the future if you tell the printer to go to Z=0.15mm it will go to this location. If you tell the printer to go to Z=0 it should hopefully touch the glass.
Typically the bottom layer thickness is 0.27mm meaning the printer sets Z=0.27mm while printing the bottom layer and it also extrudes just the right amount of material to fit that gap.
I prefer to level the printer without the calibration card (although then I tweak the 3 screws again when it starts printing) such that when you tell the printer to go to z=0.27mm it actually prints about 0.12mm between glass and nozzle. This squishes the bottom layer extra hard.
Alternatively changing bottom layer height in cura to 0.1mm seems to work very well also.
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geert_2 558
In the beginning, 2 years ago, I did several tests on the effect of bed temp on bonding of PLA.
At 60°C bonding was optimal for me.
At lower temps, for average objects usually it still worked well until 50°C. However, at 40°C models were likely to pop-off suddenly, with a loud snap, in mid-print. Below 30°C there was no bonding at all, for my models.
At higher temps at 70°C the PLA became too soft. And then corners would lift and be peeled off the bed, due to the shrinking forces from the layers above, and the whole model would warp and come off.
Thus a balance has to be found between hot enough for a good bonding, and not too hot so it does not stay too soft. The default value of 60°C for PLA seems to work best on both of my UM2. These tests were done on light blue Ultimaker PLA, and on colorFabb white and orange PLA/PHA, but they seem to be valid for other Ultimaker and colorFabb PLA too.
As bonding agent for PLA I only used my "salt method", because this worked better than the glue stick at that time. But back then I didn't know yet how thick the glue layer had to be (probably I made it too thick?), and I did not wipe the glue with a wet tissue afterwards, which seems to equalise the glue into a very thin layer and improves bonding.
For PET (or is it PETG) from ICE, a bed temp of 90°C seems to work best for me.
Before printing real objects, I recommend you design an inverted prism, with a very small ground base, and wide top. This excerts huge warping forces on a very small base, due to the overhangs. And the edges curl up, causing the nozzle to bang into them. So it is a very hard bonding test. Print this model with various bonding methods, and bed temps, stay with the printer (!!!!), and carefully watch what happens, and try which bonding method works best for you. If you can print such extremes well, it should work for average models too. I could not print this test with the glue stick, nor on a bare glass plate: the models came off and produced spaghetti. But it worked with the salt method, although edges did lift, so it was on the edge.
Picture of a sort of inverted prism being printed. If I remember well, the base was only 2mm wide, but the top was going to be 10mm wide, and somewhere around 5 or 6mm high. And as you can see, at that time I also didn't know about atomic pulls and about worn-out white teflon couplers, so there is a little bit of underextrusion.
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Brulti 177
Question: is this also true for the UM3/E?
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